Our management team has over 200 publications in both materials science applications and theoretical studies.  Each of the team members is both nationally and internationally acclaimed has presented at conferences worldwide.

Visit the links to the left to view publications, presentations, and patents of the management team.

Refereed Journal Articles: 

“Growth And Characterization Of Bulk Copper Bicrystal Twist Boundaries,” S.M. Schwarz, E.C. Houge, L.A. Giannuzzi, and A.H. King, Journal of Crystal Growth, Vol. 222, nos. 1,2, January 1, 2001, pp. 392-398. 

“Ion Channeling Effects on the FIB Milling of Copper,” B.W. Kempshall, S.M. Schwarz, B.I. Prenitzer, L.A. Giannuzzi, and F.A. Stevie, Journal of Vacuum Science & Technology B, 19(3), May/Jun, (2001), 749-754. 

“EBSP Investigation of Focused Ion Beam Surfaces,” T.L. Matteson, B.W. Kempshall, S.W. Schwarz, E.C. Houge, and L.A. Giannuzzi, Journal of Electronic Materials, 31(1), (2002), 33-39. 

“Grain Boundary Segregation: Equilibrium and Non-Equilibrium Conditions,” B.W. Kempshall, S.M. Schwarz, B.I. Prenitzer, and L.A. Giannuzzi, Scripta Materialia, 47 (7), (2002), 447-451. 

“Utilizing the SIMS technique in the study of grain boundary diffusion along twist grain boundaries in the Cu(Ni) system,” S.M. Schwarz, B.W. Kempshall, F.A. Stevie, and L.A. Giannuzzi,  Acta Materialia, 50, (2002) 5079-5084. 

“Effects of Diffusion Induced Recrystallization on the Volume Diffusion in the Copper-Nickel  System,” S.M. Schwarz, B.W. Kempshall, and L.A. Giannuzzi, Acta Materiali, 51 (10), (2003), 2765-2776.

Refereed Journal Articles in Review or in Preparation:

“Amorphization and Redeposition Effects of FIB Milled Surfaces,” S. Rajsiri, B.W. Kempshall, S.M. Schwarz, and L.A. Giannuzzi, submitted 11/4/02 to Journal of Vacuum Science & Technology. 

“The Electromigration Behavior of Single Crystal Copper,”  Catherine M. Contino, Stephen M. Schwarz, and Lucille A. Giannuzzi, submitted 11/17/02 to Scripta Materialia. 

“Epitaxial Plating of Ni on Cu,” S.M. Schwarz, B.W. Kempshall, and L.A. Giannuzzi, in preparation, Plating and Surface Finishing. 

“Effects of Bi Segregation on Ni Diffusion through Cu Twist Boundaries,” B.W. Kempshall, S.M. Schwarz, and L.A. Giannuzzi, in preparation for Acta Materialia

Referred Conference Proceedings: 

“Ni Diffusion in (100) Cu Twist Boundaries,” S.M. Schwarz, B.W. Kempshall, and L.A. Giannuzzi to be published, Proceedings of CIMTEC, Florence, Italy, July 2002, platform, International.

“Ni Diffusion in Bi Segregated (100) Cu Twist Grain Boundaries,” B.W. Kempshall, S.M. Schwarz, and L.A. Giannuzzi, to be published, Proceedings of CIMTEC, Florence, Italy, July 2002, platform, International. 

Referred Extended Abstracts (2 or more published pages): 

“Practical Aspects Of FIB Milling: Understanding Ion Beam/Material Interactions,” B. I. Prenitzer, B. W. Kempshall, S. M. Schwarz, L. A. Giannuzzi, and F. A. Stevie, Microscopy & Microanalysis, 6 (Suppl 2: Proceedings), Microscopy Society of America, pp. 502-503 (2000). 

“Use of SIMS to Determine Grain Boundary Diffusion,” S.M. Schwarz, B.W. Kempshall, L.A. Giannuzzi, and F.A. Stevie, 15^th Annual Workshop on SIMS, Clearwater, FL, April 29 – May 2, 2002, International. 

“Automated Crystallography and Grain Mapping in the TEM,” F. Bo Clayton, Brian W. Kempshall, Stephen M. Schwarz, and Lucille A. Giannuzzi, Microsc. and Microanal. 8 (Suppl. 2), (2002), Microscopy Society of America, 656-657CD. 

“FIB Damage in Silicon: Amorphization or Redeposition?,” S. Rajsiri, B. W. Kempshall, S.M. Schwarz, and L. A. Giannuzzi, Microsc. and Microanal. 8 (Suppl. 2), (2002), Microscopy Society of America, 50-51.

 “In-Situ FIB Lift-Out For Site Specific Tem Specimen Preparation Of Grain Boundaries And Interfaces,” B.W. Kempshall, S.M. Schwarz, and L.A. Giannuzzi, Proceedings of the International Congress on Electron Microscopy (ICEM 15), Vol. 1, Durban, South Africa, September 2002, 249-250.

Presentations: 

B.W. Kempshall, S. Schwarz, B.I. Prenitzer, L.A. Giannuzzi, and F.A. Stevie, “Ion Channeling Effects on the FIB Milling of Copper,”  Spring Meeting of American Vacuum Society, Santa Clara, February, 2000, International. 

B.W. Kempshall, S. Schwarz, B.I. Prenitzer, L.A. Giannuzzi, and F.A. Stevie, “Ion Channeling Effects on the FIB Milling of Copper,”  FL AVS/FSM, March, 2000, poster, National. 

S.M.Schwarz, E.C.Houge, L.A.Giannuzzi, and A.H. King, “Bicrystal Growth and Characterization of Bulk Copper Twist Boundaries,” FL AVS/FSM, March, 2000, poster, National. 

“Practical Aspects Of FIB Milling: Understanding Ion Beam/Material Interactions,” B. I. Prenitzer, B. W. Kempshall, S. M. Schwarz, L. A. Giannuzzi, and F. A. Stevie, Microscopy & Microanalysis, Philadelphia, August, 2000, invited, international. 

“Ion Channeling Effects on the FIB milling of crystalline materials,” B.W. Kempshall, S.M.Schwarz, B.I. Prenitzer, L.A.Giannuzzi, R.B. Irwin, F.A. Stevie, Intl. AVS, Boston, October, 2000, international. 

“On the Validity of Volume Diffusion Data: Diffusion Induced Recrystallization in Cu-Ni Diffusion Couples,” S.M. Schwarz, B.W. Kempshall, and L.A. Giannuzzi, FLAVS/FSM/Surface Analysis 2001, UCF, March 2001, International. 

“Channeling in Cu,” B.W. Kempshall, S.M. Schwarz, B.I. Prenitzer, L.A. Giannuzzi, F.A. Stevie, 3^rd Annual FIB Workshop, FLAVS/FSM/Surface Analysis 2001, UCF, March 2001, International. 

“EBSP Investigation of Focused Ion Beam Surfaces,” T.L. Matteson, B.W. Kempshall, S.W. Schwarz, E.C. Houge, and L.A. Giannuzzi, International Workshop on Applications of EBSD to Electronic Materials, Washington State University, May 17-18, 2001. 

“FIB Damage in Si:  Real or Artifact?,” S. Rajsiri, B.W. Kempshall, S.M. Schwarz, and L. A. Giannuzzi, FLAVS/FSM, March 12, 2002, Orlando, Invited platform, International. 

In-Situ FIB Lift-Out and TEM for Site Specific Grain Boundary Analysis, B.W. Kempshall, S. M. Schwarz, and L.A. Giannuzzi, FLAVS/FSM, March 12, 2002, Orlando, platform, International. 

“In-Situ Lift-Out and TEM for Site Specific Interdiffusion Analysis, S. M. Schwarz, B.W. Kempshall, and L.A. Giannuzzi, FLAVS/FSM, March 12, 2002, Orlando, platform, International. 

“Use of SIMS to Determine Grain Boundary Diffusion,” S.M. Schwarz, B.W. Kempshall, L.A. Giannuzzi, and F.A. Stevie, 15^th Annual Workshop on SIMS, Clearwater, FL, April 29 – May 2, 2002, poster presentation, International.  

“Ni Diffusion in (100) Cu Twist Boundaries,” S.M. Schwarz, B.W. Kempshall, and L.A. Giannuzzi, CIMTEC, Florence, Italy, July 2002, platform, International. 

“Ni Diffusion in Bi Segregated (100) Cu Twist Grain Boundaries,” B.W. Kempshall, S.M. Schwarz, and CIMTEC, Florence, Italy, July 2002, platform, International.

“Automated Crystallography and Grain Mapping in the TEM,” F. Bo Clayton, Brian W. Kempshall, Stephen M. Schwarz, and Lucille A. Giannuzzi, Microscopy and Microanalysis, Quebec City, August 2002, platform, International.

“FIB Damage in Silicon: Amorphization or Redeposition?,” S. Rajsiri, B. W. Kempshall, S.M. Schwarz, and L. A. Giannuzzi, Microscopy and Microanalysis, Quebec City, August 2002, invited platform, International.

 “In-Situ Fib Lift-Out For Site Specific Tem Specimen Preparation Of Grain Boundaries And Interfaces,” B.W. Kempshall, S.M. Schwarz, and L.A. Giannuzzi, International Congress on Electron Microscopy (ICEM), Durban, South Africa, September 2002, Invited platform, International.

“Electromigration Effects of Single Crystal Copper,” C.M. Contino, S.M. Schwarz, L.A. Giannuzzi, International AVS meeting, Denver, November 2002, platform, International